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Telcona Presents World's Smallest 0806 Crystal Unit

Telcona Presents World's Smallest 0806 Crystal Unit

Telcona proudly announces the development of the world's smallest MHz-band AT-cut quartz crystal unit, the MDS-AT0806 (tentative name). With dimensions of just 0.8mm × 0.6mm × 0.3mm, this remarkable innovation redefines miniaturization in the crystal industry and sets new benchmarks for high-performance, space-efficient electronic components.

Telcona Presents World's Smallest 0806 Crystal Unit

A Leap Forward in Size and Weight Reduction

The MDS-AT0806 is a game-changer in frequency control technology. Compared to its predecessor, the FCX-08 (1.2mm × 1.0mm × 0.3mm), the new unit boasts:
- approximately 60% reduction in volume
- about 75% decrease in weight

This unprecedented size reduction is achieved through advanced wafer-level vacuum packaging (MDS) combined with photolithographic microfabrication techniques, ensuring exceptional frequency stability and high reliability in ultra-compact applications.

Enabling the Next Wave of Miniaturized Devices

The demand for smaller, lighter, and more efficient electronic components continues to rise, particularly in IoT, medical, wearable technology, and industrial applications. The MDS-AT0806 is engineered to meet these stringent requirements, enabling manufacturers to push the boundaries of miniaturization without compromising performance.

Prototypes of this revolutionary crystal unit have already been supplied to leading global manufacturers for evaluation in their next-generation product designs. With its compact size and superior performance, the MDS-AT0806 is poised to become the preferred choice for applications requiring precise frequency control in space-constrained environments.

Product Highlights

  • World’s Smallest Dimensions: 0.8mm x 0.6mm x 0.3mm max MHz AT-cut crystal unit.
  • Compact and Lightweight
  • Approximately 60% volume reduction compared to the FCX-08 (1.2mm x 1.0mm x 0.3mm max).
  • About 75% weight reduction.
  • Advanced Technologies:
  • Wafer-level vacuum packaging (MDS) using solid-phase diffusion bonding.
  • Enhanced frequency stability through photolithographic microfabrication technique.
  • Proven Reliability
  • Diverse Applications
  • Meets the needs for miniaturization and space-saving in medical, wearable tech, and more.
  • Exceptional Dimensional Accuracy
  • Achieves high-frequency accuracy through precise microfabrication and innovative sealing techniques.
  • Applications: Communication equipment, supercomputers, measuring instruments